JPH05863B2 - - Google Patents
Info
- Publication number
- JPH05863B2 JPH05863B2 JP22565089A JP22565089A JPH05863B2 JP H05863 B2 JPH05863 B2 JP H05863B2 JP 22565089 A JP22565089 A JP 22565089A JP 22565089 A JP22565089 A JP 22565089A JP H05863 B2 JPH05863 B2 JP H05863B2
- Authority
- JP
- Japan
- Prior art keywords
- sub
- electrode terminal
- plate
- terminal
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 2
- 238000005452 bending Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22565089A JPH02110962A (ja) | 1989-08-31 | 1989-08-31 | 半導体モジュールおよびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22565089A JPH02110962A (ja) | 1989-08-31 | 1989-08-31 | 半導体モジュールおよびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02110962A JPH02110962A (ja) | 1990-04-24 |
| JPH05863B2 true JPH05863B2 (en]) | 1993-01-06 |
Family
ID=16832623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22565089A Granted JPH02110962A (ja) | 1989-08-31 | 1989-08-31 | 半導体モジュールおよびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02110962A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3284256B2 (ja) * | 1995-04-07 | 2002-05-20 | セイコーエプソン株式会社 | プリンタ |
| DE10129006B4 (de) * | 2001-06-15 | 2009-07-30 | Conti Temic Microelectronic Gmbh | Elektronische Baugruppe |
-
1989
- 1989-08-31 JP JP22565089A patent/JPH02110962A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02110962A (ja) | 1990-04-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |